CXD3526GG Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXD3526GG

Digital Signal Driver/Timing Generator

Sony Semiconductor 

Package Outline

Unit: mm

0.2 S A

12.0

PIN 1 INDEX

144PIN BGA

X

CXD3526GG

1.25

+0.20

- 0.10

0.38 ± 0.10

0.1 S

x4

0.15

DETAIL X

SOLDER BALL

A

144-φ0.45 ± 0.01

0.8

φ0.08 M S AB

N

M

L

K

J

H

PIN 1 INDEX

G

F

E

D

C

B

A

1 2 3 4 5 6 7 8 9 10 11 12 13

1.2

SONY CODE

JEITA CODE

JEDEC CODE

BGA-144P-021

P-BGA144-12X12-0.8

B

PACKAGE STRUCTURE

PACKAGE MATERIAL

EPOXY RESIN

BOARD MATERIAL

COPPER-CLAD LAMINATE

TERMINAL MATERIAL SOLDER

PACKAGE MASS

0.31g

– 88 –

Sony Corporation

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