HCD66727A03 Просмотр технического описания (PDF) - Hitachi -> Renesas Electronics
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HCD66727A03
Hitachi -> Renesas Electronics
HCD66727A03 Datasheet PDF : 97 Pages
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HD66727 Mounting Variations and Key-Matrix Configurations
(1) COB-1
LCD glass
COB board
Chip
RC
C
Heat seal
ON F1 F2
123
456
789
∗0#
Key-matrix board
(2) COB-2
LCD glass
(3) TCP
LCD glass
Heat seal
TCP
Chip
Chip
RC
C
ON F1 F2
123
456
789
∗0#
Key-matrix board
R
C
C
ON F1 F2
123
456
789
∗ 0#
Key-matrix board
Figure 1 HD66727 Mounting Variations
HD66727
(4) COG
LCD glass
Chip
Heat seal
RC
C
ON F1 F2
123
456
789
∗0#
Key-matrix board
Table 2
Configurations of LCD Modules (LCM) with Key Scan Function for Different Mounting
Methods
Parts
LCD glass
LCM (COB)
substrate
HD66727
package
Heat seal
Key matrix
substrate
Chip-on-Board
(COB) Mounting 1
Necessary
Necessary
Bare chip
Necessary
Necessary
Chip-on-Board
(COB) Mounting 2
Necessary
Not necessary
Tape-Carrier-
Package (TCP)
Mounting
Necessary
Not necessary
Bare chip
TCP
Necessary
Necessary
Optional
Necessary
Chip-on-Glass
(COG) Mounting
Necessary
Not necessary
Bumped chip
Necessary
Necessary
11
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