HCD66727A03 Просмотр технического описания (PDF) - Hitachi -> Renesas Electronics
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HCD66727A03
Hitachi -> Renesas Electronics
HCD66727A03 Datasheet PDF : 97 Pages
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HD66727
HD66727 Pad Arrangement
Chip size: 11.39 µm × 2.89 µm
Pad coordinates: Pad center
Coordinate origin: Chip center
Pad pitch: 120 µm
Al pad size: 90 µm × 90 µm
Au bump size: 70 µm × 70 µm
DUM1
VVVCCCCCC
DUM2
DUM3
V1OUT
V2OUT
V3OUT
V4OUT
V5OUT
VREFP
VREF
VREFM
V2
V3
VEE
VEE
V5OUT3
V5OUT3
V5OUT2
V5OUT2
C1
C1
C1
C2
C2
C2
Vci
Vci
GND
GND
VCC
VCC
OSC2
OSC1
EXM
OPOFF
TEST
RESET*
IM
VCCDUM1
ID0
VCCDUM2
ID1/CS*
SCL
SDA
KIN0
KIN1
KIN2
KIN3
KST0
KST1
KST2
KST3
KST4
KST5
KST6
KST7
IRQ*
LED0
LED1
LED2
PORT0
PORT1
PORT2
GND
GND
GND
AGND
DUM4
HD66727
(TOP view)
Y
X
DUM14
DUM13
DUM12
DUM11
DUM10
SEG60/1
SEG59/2
SEG58/3
SEG57/4
SEG56/5
SEG55/6
SEG54/7
SEG53/8
SEG52/9
SEG51/10
SEG50/11
SEG49/12
SEG48/13
SEG47/14
SEG46/15
SEG45/16
SEG44/17
SEG43/18
SEG42/19
SEG41/20
SEG40/21
SEG39/22
SEG38/23
SEG37/24
SEG36/25
SEG35/26
SEG34/27
SEG33/28
SEG32/29
SEG31/30
SEG30/31
SEG29/32
SEG28/33
SEG27/34
SEG26/35
SEG25/36
SEG24/37
SEG23/38
SEG22/39
SEG21/40
SEG20/41
SEG19/42
SEG18/43
SEG17/44
SEG16/45
SEG15/46
SEG14/47
SEG13/48
SEG12/49
SEG11/50
SEG10/51
SEG9/52
SEG8/53
SEG7/54
SEG6/55
SEG5/56
SEG4/57
SEG3/58
SEG2/59
SEG1/60
ASEG12
ASEG11
ASEG10
ASEG9
ASEG8
ASEG7
ASEG6
ASEG5
ASEG4
ASEG3
ASEG2
ASEG1
ACOM1
DUM9
DUM8
DUM7
DUM6
DUM5
8
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