HCS161D Просмотр технического описания (PDF) - Intersil
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HCS161D Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
104 x 86 mils
2650 x 2190mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCS161MS
HCS161MS
CP
MR
VCC
(2)
(1)
(16)
P0 (3)
P1 (4)
P2 (5)
P3 (6)
(15) TC
(14) Q0
(13) Q1
(12) Q2
PE (7)
(11) Q3
(8)
(9)
(10)
GND
SPE
TE
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS161 is TA14346A.
Spec Number 518755
201
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