HCS373DMSR Просмотр технического описания (PDF) - Intersil
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HCS373DMSR Datasheet PDF : 10 Pages
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HCS373MS
Die Characteristics
DIE DIMENSIONS:
2747 x 2693µm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
D0
Q0
(3)
(2)
HCS373MS
OE
VCC
Q7
(1)
(20)
(19)
D1 (4)
Q1 (5)
Q2 (6)
D2 (7)
(18) D7
(17) D6
(16) Q6
(15) Q5
(14) D5
(8)
(9)
D3
Q3
(10)
(11)
GND
LE
(12)
(13)
Q4
D4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS373 is TA14303A.
Spec Number 518845
355
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