ISL6446A
FP2 = 2------------R--1---3-------C-----3-
(EQ. 23)
Figure 27 shows an asymptotic plot of the DC/DC converter’s gain vs
frequency. The actual Modulator Gain has a high gain peak
dependent on the quality factor (Q) of the output filter, which is not
shown. Using the previously mentioned guidelines should yield a
compensation gain similar to the curve plotted. The open loop error
amplifier gain bounds the compensation gain. Check the
compensation gain at FP2 against the capabilities of the error
amplifier. The closed loop gain, GCL, is constructed on the log-log
graph of Figure 27 by adding the modulator gain, GMOD (in dB), to
the feedback compensation gain, GFB (in dB). This is equivalent to
multiplying the modulator transfer function and the compensation
transfer function and then plotting the resulting gain.
FZ1FZ2 FP1
FP2
MODULATOR GAIN
COMPENSATION GAIN
CLOSED LOOP GAIN
OPEN LOOP E/A GAIN
within 1 inch of the MOSFETs, Q1 and Q2. The circuit traces for the
MOSFETs’ gate and source connections from the ISL6446A must
be sized to handle up to 2A peak current.
VIN
ISL6446A
UGATE
PHASE
LGATE
PGND
Q1
LOUT VOUT
CIN
Q2
COUT
RETURN
FIGURE 28. PRINTED CIRCUIT BOARD POWER AND GROUND
PLANES OR ISLANDS
20 log
-RR----1-2-
0
LOG
20log d----M---V--A---O-X---S----C-V----I--N-- GFB
GCL
FLC FCE F0
GMOD
FREQUENCY
FIGURE 27. ASYMPTOTIC BODE PLOT OF CONVERTER GAIN
A stable control loop has a gain crossing with close to a
-20dB/decade slope and a phase margin greater than 45°.
Include worst case component variations when determining
phase margin. The mathematical model presented makes a
number of approximations and is generally not accurate at
frequencies approaching or exceeding half the switching
frequency. When designing compensation networks, select
target crossover frequencies in the range of 10% to 30% of the
switching frequency, fSW.
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using wide,
short, printed circuit traces. The critical components should be
located as close together as possible using ground plane
construction or single point grounding.
Figure 28 on page 19 shows the critical power components of
the converter. To minimize the voltage overshoot, the
interconnecting wires indicated by heavy lines should be part of
ground or power plane in a printed circuit board. The components
shown in Figure 28 should be located as close together as
possible. Please note that the capacitors CIN and COUT each
represent numerous physical capacitors. Locate the ISL6446A
FN8384 Rev 3.00
Aug 27, 2015
CVCC
PGND
RRT CSS
VCC
BOOT
CBOOT CIN
ISL6446A
SS PHASE
RT
VIN
+VIN
SGND PGND
CVIN
SGND
+VIN
Q1 LOUT
VOUT
Q2 COUT
PGND
FIGURE 29. PRINTED CIRCUIT BOARD POWER AND GROUND
PLANES OR ISLANDS
Page 19 of 22