AD8555 Просмотр технического описания (PDF) - Analog Devices
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AD8555 Datasheet PDF : 29 Pages
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Data Sheet
AD8555
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) 1
5
6.20 (0.2441)
4 5.80 (0.2284)
0.25 (0.0098)
0.10 (0.0040)
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
0.50 (0.0196) 45°
0.25 (0.0099)
8°
0°
1.27 (0.0500)
0.25 (0.0098) 0.40 (0.0157)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 63. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters (inches)
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.65
BSC
0.35
0.30
0.25
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
2.40
2.35 SQ
2.30
9
4
0.50
8
5
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC-3.
Figure 64. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-20)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD8555ARZ
AD8555ARZ-REEL
AD8555ARZ-REEL7
AD8555ACPZ-R2
AD8555ACPZ-REEL
AD8555ACPZ-REEL7
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
1 Z = RoHS Compliant Part.
Package Description
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
16-Lead LFCSP_WQ
16-Lead LFCSP_WQ
16-Lead LFCSP_WQ
Package Option
R-8
R-8
R-8
CP-16-20
CP-16-20
CP-16-20
©2004–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04598-0-2/15(B)
Rev. B | Page 29 of 29
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