WeEn Semiconductors
BT136S-600D
4Q Triac
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-mb)
thermal resistance
from junction to
mounting base
full cycle; Fig. 6
half cycle; Fig. 6
Rth(j-a)
thermal resistance
in free air
[1]
from junction to
ambient free air
[1] printed circuit board (FR4) mounted; standard footprint, single-sided copper, tin-plated
10
Zth(j-mb)
(K/W)
1
unidirectional
bidirectional
Min Typ Max Unit
-
-
3
K/W
-
-
3.7 K/W
-
75
-
K/W
003aae836
10- 1
P
10- 2
10- 5
10- 4
10- 3
10- 2
10- 1
tp
t
1
10
tp (s)
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width
BT136S-600D
Product data sheet
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15 September 2018
© WeEn Semiconductors Co., Ltd. 2018. All rights reserved
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