C3225X5R1C226M Просмотр технического описания (PDF) - Orister Corporation
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C3225X5R1C226M Datasheet PDF : 10 Pages
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Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface‐mount devices
Figure 1: Temperature profile
TP
TL
Tsmax
Ramp-up
tP
tL
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Average ramp‐up rate (TL to TP)
Preheat
‐ Temperature Min (Tsmin)
‐ Temperature Max (Tsmax)
‐ Time (min to max) (ts)
Tsmax to TL
‐ Ramp‐up Rate
Time maintained above:
‐ Temperature (TL)
‐ Time (tL)
Peak Temperature (TP)
Time within 5oC of actual Peak
Temperature (tP)
Ramp‐down Rate
Time 25oC to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb‐Free devices.
Sn‐Pb Eutectic Assembly
<3oC/sec
100oC
150oC
60~120 sec
<3oC/sec
183oC
60~150 sec
240oC +0/‐5oC
10~30 sec
<6oC/sec
<6 minutes
Peak temperature
245oC ±5oC
260oC +0/‐5oC
Page No. : 9/10
Critical Zone
TL to TP
Pb‐Free Assembly
<3oC/sec
150oC
200oC
60~180 sec
<3oC/sec
207oC
60~150 sec
260oC +0/‐5oC
20~40 sec
<6oC/sec
<8 minutes
Dipping time
5sec ±1sec
5sec ±1sec
DS‐RS6516‐05 February, 2010
www.Orister.com
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