DEVICE
UNDER
TEST
TEST POINT
OUTPUT
CL*
*Includes all probe and jig capacitance
Figure 4.
MC74HC367A
TEST CIRCUITS
DEVICE
UNDER
TEST
TEST POINT
OUTPUT
1 kW
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 5.
TO OTHER
BUFFERS
ONE OF 6
BUFFERS
VCC
Y
A
OUTPUT ENABLE
Figure 6. Logic Detail
ORDERING INFORMATION
Device
Package
Shipping†
MC74HC367ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC367ADR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74HC367ADTG
TSSOP−16
(Pb−Free)
96 Units / Tube
MC74HC367ADTR2G
TSSOP−16
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5