DSA6312HA1LB-T Просмотр технического описания (PDF) - Microchip Technology

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DSA6312HA1LB-T

Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum for Automotive

Microchip Technology 

DSA63XX

4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

X

4

C

Y

G2

(CH)

1

2

G1

E

SILK SCREEN

RECOMMENDED LAND PATTERN

Units

Dimension Limits

Contact Pitch

E

Contact Spacing

C

Contact Width (X4)

X

Contact Pad Length (X6)

Y

Space Between Contacts (X4)

G1

Space Between Contacts (X3)

G2

Contact 1 Index Chamfer

CH

MILLIMETERS

MIN

NOM

MAX

1.65 BSC

1.25

0.70

0.80

0.95

0.45

0.13 X 45° REF

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-3202A

DS20006189A-page 20

 2019 Microchip Technology Inc.

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