PACGAME-1Q/R Просмотр технического описания (PDF) - California Micro Devices => Onsemi
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PACGAME-1Q/R
California Micro Devices => Onsemi
PACGAME-1Q/R Datasheet PDF : 3 Pages
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CALIFORNIA MICRO DEVICES
QSOP - TOP VIEW
HN
CAMD
EH
1
PACGAME-1
POWER DERATING CURVE
D
e
B
C
L
A
A1
MECHANICAL SPECIFICATIONS
Lead Plating
Tin-Lead
Lead Material
Copper Alloy
Lead Coplanarity
0.004" (0.102mm)
Substrate Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94V-0
PACKAGE DIMENSIONS,
POWER DISSIPATION & INFORMATION
Package
QSOP
Pins #
28
JEDEC
MO137
mm
inches
min
max
min
max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
B
0.20
0.30
0.008
0.012
C
0.18
0.25
0.006
0.010
D
9.80
9.98
0.386
0.393
E
3.81
3.98
0.150
0.157
e
0.64 BSC
0.025 BSC
H
5.79
6.20
0.228
0.244
L
0.40
1.27
0.016
0.050
PD @ 70°C
# / tube
1.00W
50 pcs
# / tape & reel
2,500 pcs
© 2000 California Micro Devices Corp. All rights reserved.
4/00
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
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