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DS1643-120 Просмотр технического описания (PDF) - Dallas Semiconductor -> Maxim Integrated

Номер в каталоге
Компоненты Описание
производитель
DS1643-120
Dallas
Dallas Semiconductor -> Maxim Integrated 
DS1643-120 Datasheet PDF : 13 Pages
First Prev 11 12 13
DS1643P
TOP VIEW
SIDE VIEW
BOTTOM VIEW
DS1643/DS1643P
PKG
DIM
A
B
C
D
E
F
G
INCHES
MIN
0.920
0.980
0.052
0.048
0.015
0.025
NOM
0.925
0.985
0.055
0.050
0.020
0.027
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
NOTE: For the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder reflow
oriented with the label side up (“live – bug”).
b. Hand Soldering and touch–up: Do not touch or apply the soldering iron to leads for more than 3 (three) seconds.
To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply flux, heat
the lead frame pad until the solder reflows and use a solder wick to remove solder.
031698 11/13

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