HCTS139MS 查看數據表（PDF） - Intersil

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HCTS139MS

Radiation Hardened Dual 2-to-4 Line Decoder/Demultiplexer

Intersil 

Die Characteristics

DIE DIMENSIONS:

2.74mm x 2.68mm

108 mils x 106 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

A0 1

(2)

HCTS139MS

HCTS139MS

E1 1

VCC

E2

(1)

(16)

(15)

A1 1 (3)

Y0 1 (4)

Y1 1 (5)

(14) 2 A0

(13) 2 A1

(12) 2 Y0

(11) 2 Y1

Y2 2 (6)

(10) 2 Y2

(7)

Y3 1

(8)

GND

(9)

2 Y3

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS139 is TA14409.

Spec Number 518606

528

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