HCTS04D 查看數據表（PDF） - Intersil
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HCTS04D Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20mm x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
Y1 (2)
A2 (3)
Y2 (4)
A3 (5)
HCTS04MS
HCTS04MS
A1
VCC
A6
(1)
(14)
(13)
(6)
(7)
(8)
Y3
GND
Y4
(12) Y6
(11) A5
(10) Y5
(9) A4
Spec Number 518776
387
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