L9337MD 查看數據表（PDF） - STMicroelectronics
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L9337MD Datasheet PDF : 8 Pages
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L9337MD
THERMAL DATA
Symbol
Rth (j-pins)
Rth (j-amb)
TjMon
Parameter
Thermal resistance junction to pin
Thermal resistance junction to ambient mounted on
SMPCB2 board
Temperature-monitoring
Switch-off-level
Switch-on-level
SO20 (2)
–
77 to 97
SO(12+4+4) (1)
14 (Typ.)
–
Unit
°C/W
°C/W
160 to 190
°C
140 to 170
°C
(1) See SGS-THOMSON Microelectronics databook:”Thermal Management in Surface Mount Technology”
(2) See SGS-THOMSON Microelectronics databook:”Thermal characteristics of SO20”
OPERATING CONDITIONS (The electrical characteristics are valid within the below defined operating
ranges, unless otherwise specified. The function will be guarantedby design until TjMON switch-OFF-level.
Symbol
VS
VIN
VEN
VOUT, VD
Tj
Supply Voltage
Input pin voltage
Enable pin voltage
Output pin voltage
Junction temperature
Parameter
Value
4.5 to 32
-24 to 45
-24 to 45
-0.3 to 45
-40 to 150
Unit
V
V
V
V
°C
ELECTRICAL CHARACTERISTICS (Refer to the test circuit, unless otherwise specified.)
Symbol
IQ
Parameter
Quiescent current
Inputs IN1 - IN3, PRG
VINIlow
Input voltage LOW
VINhigh
Input voltage HIGH
IIN
Input current
Enable Input EN
VENlow
Input voltage LOW
VENhigh Input voltage HIGH
REN
Input impedance
IEN
Input current
Outputs OUT1-OUT3
RDSon
Output ON-resistor to ground
IOLeak
Leakage current
VOClamp Output voltage during clamping
IOSC
Short-circuit current
CO
Internal output capacities
Diagnostic output DIAG
VDlow
Output voltage LOW
IDmax
Max. Output current
IDleak
Leakage current
Test Condition
-0.3V ≤ VEN ≤ 0.5V;
VS = 14V; Tj = 85°C
EN = high; VS ≤ 14V
-24V ≤ Vi ≤ 10V
-24V < Vi < 2.5V
2.5V ≤ Vi ≤ 25V
VS ≥ 6V, IO = 0.3A
Tj = 25°C
Tj = 125°C
VO = VS = 14V; Tj = 85°C
time < 200µs; 10mA ≤ Io ≤ 0.3A
VO ≥ 4.5V
IDL ≤ 1mA
Internal current limitation
VS = 14V; TJ = 85°C
Min.
-24
2.8
-10
-24
3.2
10
45
400
1
Typ.
<2
1.5
20
1.7
≤1
52
700
0.3
5
≤ 0.1
Max.
10
2
2.0
45
15
1
VS
50
2.3
3.5
5
60
1200
100
0.5
15
1
Unit
µA
mA
V
V
µA
V
V
KΩ
µA
Ω
Ω
µA
V
mA
pF
V
mA
µA
3/8
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