WLP200 查看數據表（PDF） - California Micro Devices => Onsemi
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WLP200 Datasheet PDF : 6 Pages
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CALIFORNIA MICRO DEVICES
WLP200
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
0.325mm
Solder Stencil Thickness
0.152mm
Solder Stencil Aperture Opening
0.33mm (sq.)
Solder Flux Ratio
50/50
No Clean Solder Paste
Bond Trace Finish
OSP (Entek Cu Plus 106A)
ESD SPECIFICATIONS
ESD Protection (Guaranteed by Design)
MIN
Peak Discharge Voltage at any I/O, Human Body Model, Method 3015 (Note 1)
–15KV
In System Protection, IEC 1000-4-2, Level 4 (Note 2 & 3)
–8KV
Channel Clamp Voltage @ 8KV ESD Pulses, Human Body Model (Notes 1 & 2)
–30V
Note 1: Human Body Model per MIL-STD-883, Method 3015
CDischarge = 100pF, RDischarge = 1.5KΩ, pins B2, C2, B3, C3, B4, C4, B5, C5 are at ground.
ESD Contact Discharge from pins B1, A1, A2, A3, A4 and A5 one at a time.
Note 2: Pins B2, C2, B3, C3, B4, C4, B5, C5 are grounded. ESD Contact Discharge between
pins B1, A1, A2, A3, A4 and A5 and ground one at a time.
Note 3: Standard IEC 1000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, pins B2, C2, B3, C3, B4, C4, B5, C5 are at ground.
MAX
15KV
8KV
30V
Typical Solder Reflow Thermal Profile (No Clean Flux)
250
EXH PH
225
200
175
150
125
100
75
50
25
0
48
Z2
Z3
Z4
Z5
RF
97
145
194
242
290
Time (s)
CD
EXH
339
387
435
© 2000 California Micro Devices Corp. All rights reserved.
11/10/2000 215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
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