ADG784BCP 查看數據表（PDF） - Analog Devices
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ADG784BCP Datasheet PDF : 10 Pages
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ADG784
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.50
BSC
0.30
0.25
0.18
16
15
20
1
EXPOSED
PAD
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
11
5
0.65
0.60
10
6
BOTTOM VIEW
0.20 MIN
0.55
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1.
Figure 37. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADG784BCPZ
ADG784BCPZ-REEL
ADG784BCPZ-REEL7
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
REVISION HISTORY
2/13—Rev. 0 to Rev. A
Changes to Pin Configuration.........................................................4
Updated Outline Dimensions..........................................................9
Changes to Ordering Guide.............................................................9
4/01—Revision 0: Initial Version
Package Description
20-Lead LFCSP_WQ
20-Lead LFCSP_WQ
20-Lead LFCSP_WQ
Package Option
CP-20-6
CP-20-6
CP-20-6
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02374-0-2/13(A)
Rev. A | Page 9
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