NXP Semiconductors
74LVC16374A; 74LVCH16374A
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
12. Package outline
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
SOT370-1
D
y
Z
48
pin 1 index
1
e
c
25
E
A
X
HE
vM A
24
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.8
0.4
0.2
2.35
2.20
0.25
0.3
0.2
0.22 16.00
0.13 15.75
7.6
7.4
0.635
10.4
10.1
1.4
1.0
0.6
1.2
1.0
0.25 0.18
0.1
0.85
0.40
8o
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT370-1
REFERENCES
JEDEC
JEITA
MO-118
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT370-1 (SSOP48)
74LVC_LVCH16374A_7
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 07 — 23 March 2010
© NXP B.V. 2010. All rights reserved.
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