D78044H 查看數據表（PDF） - NEC => Renesas Technology

零件编号

产品描述 (功能)

生产厂家

D78044H

8-BIT SINGLE-CHIP MICROCOMPUTER / UPD78044H

NEC => Renesas Technology 

µPD78044H, 78045H, 78046H

12. RECOMMENDED SOLDERING CONDITIONS

The conditions listed below shall be met when soldering the µPD78044H, µPD78045H, or µPD78046H.

For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting

Technology Manual (C10535E).

Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under

different conditions.

Table 12-1 Soldering Conditions for Surface-Mount Devices

µPD78044HGF-×××-3B9: 80-pin plastic QFP (14 × 20 mm)

µPD78045HGF-×××-3B9: 80-pin plastic QFP (14 × 20 mm)

µPD78046HGF-×××-3B9: 80-pin plastic QFP (14 × 20 mm)

Soldering process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Soldering conditions

Peak package's surface temperature: 235 °C

Reflow time: 30 seconds or less (210 °C or more)

Maximum allowable number of reflow processes: 3

Peak package's surface temperature: 215 °C

Reflow time: 40 seconds or less (200 °C or more)

Maximum allowable number of reflow processes: 3

Solder temperature: 260 °C or less

Flow time: 10 seconds or less

Number of flow processes: 1

Preheating temperature : 120 °C max.

(measured on the package surface)

Terminal temperature: 300 °C or less

Heat time: 3 seconds or less (for one side of a device)

Recommended conditions

IR35-00-3

VP15-00-3

WS60-00-1

—

Caution Do not apply two or more different soldering methods to one chip (except for partial heating

method for terminal sections).

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