HCTS109K 查看數據表（PDF） - Intersil
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HCTS109K Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 X 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
J1
(2)
HCTS109MS
HCTS109MS
R1
VCC
(1)
(16)
K1 (3)
CP1 (4)
S1 (5)
Q1 (6)
(15) R2
(14) J2
(13) K2
(12) CP2
Q1 (7)
(11) S2
(8)
GND
(9)
(10)
Q2
Q2
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS109 is TA14440A.
Spec Number 518601
18
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