HA-5112/883
Die Characteristics
DIE DIMENSIONS:
98.4 x 67.3 x 19 mils ± 1 mils
2500 x 1710 x 483µm ± 25.4µm
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16kÅ ± 2kÅ
GLASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ± 2kÅ
Nitride Thickness: 3.5kÅ ± 1.5kÅ
WORST CASE CURRENT DENSITY:
1.43 x 105A/cm2 at 10mA
SUBSTRATE POTENTIAL (Powered Up):
Unbiased
TRANSISTOR COUNT: 93
PROCESS: Bipolar Dielectric Isolation
Metallization Mask Layout
HA-5112/883
V-
+IN1
-IN1
OUT1
+IN2
-IN2
OUT2
V+
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3-123
Spec Number 511032-883