AD5421 查看數據表（PDF） - Analog Devices
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AD5421 Datasheet PDF : 36 Pages
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Data Sheet
AD5421
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
5.10
5.00 SQ
4.90
TOP VIEW
0.50
BSC
0.30
0.25
0.18
25
32
24
1
EXPOSED
PAD
PIN 1
INDICATOR
3.65
3.50 SQ
3.45
0.50
0.40
0.30
8
17
16
9
BOTTOM VIEW
3.50 REF
0.25 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
Figure 54. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-11)
Dimensions shown in millimeters
9.80
5.55
9.70
5.50
9.60
5.45
28
1
PIN 1
INDICATOR
1.20 MAX
TOP VIEW
SEATING
PLANE
0.30 0.65 BSC
0.19
15
4.50
4.40
4.30
6.40
14
BSC
1.05
1.00
0.80
0.15 MAX 8°
0.05 MIN
0°
COPLANARITY
0.10
0.20
0.09
EXPOSED
PAD
(Pins Up)
3.05
3.00
2.95
BOTTOM VIEW
FOR PROPER CONNECTION OF
0.25 THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
0.75
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AET
Figure 55. 28-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]
(RE-28-2)
Dimensions shown in millimeters
Rev. H | Page 35 of 36
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