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F67051-000 查看數據表(PDF) - TE Connectivity

零件编号
产品描述 (功能)
生产厂家
F67051-000
Te
TE Connectivity 
F67051-000 Datasheet PDF : 28 Pages
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Table R5 Physical Characteristics and Environmental Specifications for Radial-leaded Devices
RKEF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
-40°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±10%
±10%
No change
Cont’d
RUEF
Physical Characteristics
Lead material
RUEF090 to RUEF250: Tin-plated copper-clad steel, 0.205mm2 (24AWG)
RUEF300 to RUEF900: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)
Soldering characteristics
Solderability per ANSI/J-STD-002 Category 3
Solder heat withstand
per IEC-STD 68-2-20, Test Tb, Method1A, Condition B, can withstand 10 seconds at 260°C ±5°C
Insulating material
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature
-40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
RUSBF
Physical Characteristics
Lead material
RUSBF075: Tin-plated nickel-copper alloy, 0.205mm2 (24AWG), ø0.51mm/0.020in.
RUSBF090 to RUSBF250: Tin-plated copper clad-steel, 0.205mm2 (24AWG), ø0.51mm/0.020in.
Soldering characteristics
Solderability per ANSI/J-STD-002 Category 3 except
RUSBF075 meet ANSI/J-STD-002 Category 1
Solder heat withstand
RUSBF120: per IEC-STD 68-2-20, Test Tb, Method 1A, Condition A; can withstand 5 seconds at 260°C ±5°C
All others: per IEC-STD 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ±5°C
Insulating material
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature
-40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
12
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
RoHS Compliant, ELV Compliant
151

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