Philips Semiconductors
5. Thermal characteristics
Table 4: Thermal characteristics
Symbol Parameter
Rth(j-sp) thermal resistance from junction to solder point
Rth(j-a) thermal resistance from junction to ambient
Conditions
see Figure 4
[1] Mounted on a printed-circuit board; minimum footprint; vertical in still air
2N7002F
N-channel TrenchMOS FET
Min Typ Max Unit
-
-
150 K/W
[1] -
-
350 K/W
103
003aab358
Zth(j-sp)
(K/W)
102
δ =0.5
0.2
0.1
10 0.05
0.02
single pulse
1
10-5
10-4
10-3
10-2
10-1
1
10
tp (s)
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration
2N7002F_3
Product data sheet
Rev. 03 — 28 April 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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