61090 查看數據表（PDF） - Micropac Industries
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61090 Datasheet PDF : 2 Pages
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61090
SURFACE MOUNT (NPN)
GENERAL PURPOSE TRANSISTOR
(2N2222AUB)
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
Features:
• Hermetically sealed
• Miniature package to minimize circuit board area
• Ceramic surface mount package
• Footprint and pin-out matches SOT-23 packaged
transistors
• MIL-PRF-19500 screening available
Applications:
• Analog Switches
• Signal Conditioning
• Small Signal Amplifiers
• High Density Packaging
DESCRIPTION
The 61090 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic
package is ideal for designs where board space and device weight are important requirements. This device is available
custom binned to customer specifications or screened to MIL-PRF-19500.
ABSOLUTE MAXIMUM RATINGS
Collector-Base Voltage ...............................................................................................................................................................75V
Collector-Emitter Voltage............................................................................................................................................................50V
Emitter-Collector Voltage..............................................................................................................................................................6V
Continuous Collector Current ............................................................................................................................................... 800mA
Power Dissipation (Derate at the rate of 3.33 mW/°C above 25°C) .................................................................................. 500mW
Maximum Junction Temperature..........................................................................................................................................+200°C
Operating Temperature (See part selection guide for actual operating temperature) ......................................... -65°C to +200°C
Storage Temperature............................................................................................................................................. -65°C to +200°C
Lead Soldering Temperature (vapor phase reflow for 30 seconds) .....................................................................................215°C
Package Dimensions
Schematic Diagram
ORIENTATION KEY
0.105 [2.67]
0.085 [2.16]
0.125 [3.18]
0.115 [2.92]
0.054 [1.37]
0.046 [1.17]
3
0.036 [0.91]
0.024 [0.61]
3 PLACES
2
1
0.024 [0.61]
0.016 [0.41]
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
C3
E2
B1
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION • 725 E. Walnut St., Garland, TX 75040 • (972) 272-3571 • Fax (972) 487-6918
www.micropac.com E-MAIL: optosales@micropac.com
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