Electrical Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol Parameter
Test Conditions
VOL
II
IOFF
ICC
ΔICC
Ci
Low Level
Output Voltage
Input Current
Power Down
Leakage
Current
Supply Current
Additional
Supply Current
Input
Capacitance
IOL = 100μA
IOL = 4mA
IOL = 8mA
IOL = 12mA
IOL = 16mA
IOL = 24mA
IOL = 32mA
VI = 5.5 V or GND
VI or VO = 5.5V
VI = 5.5V or GND
IO=0
Input at
VCC –0.6 V
Vi = VCC – or GND
VCC
1.65V to 5.5V
1.65V
2.3V
2.7V
3V
4.5V
0 to 5.5V
0V
5.5V
3V to 5.5V
3.3V
-40°C to +85°C
Min
Typ
Max
—
—
0.1
—
—
0.45
—
—
0.3
—
—
0.4
—
—
0.4
—
—
0.55
—
—
0.55
—
± 0.1
±5
—
—
±10
—
0.1
10
—
—
500
—
5
—
74LVC1G07
-40°C to +125°C
Unit
Min
Max
—
0.1
—
0.7
—
0.45
—
0.6
V
—
0.6
—
0.8
—
.8
—
± 100
μA
—
±200
μA
—
200
μA
—
5,000
μA
—
—
pF
Package Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
θJA
θJC
Parameter
Thermal Resistance
Junction-to-Ambient
Thermal Resistance
Junction-to-Case
Test Conditions
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
VCC
(Note 10)
(Note 10)
Min
Typ
Max
Unit
—
204
—
—
371
—
—
231
—
—
400
—
°C/W
—
435
—
—
445
—
—
470
—
—
460
—
—
52
—
—
143
—
—
105
—
—
225
—
°C/W
—
250
—
—
250
—
—
275
—
—
265
—
Note:
10. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
74LVC1G07
Document number: DS32274 Rev. 9 - 2
4 of 16
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April 2016
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