OUTLINE DIMENSIONS
*1.85
1.71
1.40
17.20
17.00 SQ
16.80
BALL A1
CORNER
TOP VIEW
DETAIL A
15.00
BSC SQ
1.00
BSC
A1 CORNER
INDEX AREA
16 14 12 10 8 6 4 2
15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
BOTTOM VIEW
DETAIL A
*1.31
1.21
1.10
*0.30 MIN
SEATING
PLANE
0.70
0.60
COPLANARITY
0.20
0.50
BALL DIAMETER
COMPLIANT TO JEDEC STANDARDS MO-192-AAF-1
EXCEPT FOR DIMENSIONS INDICATED BY A "*" SYMBOL.
Figure 77. 256-Lead Chip Scale Package Ball Grid Array [CSPBGA]
(BC-256-2)
Dimensions shown in millimeters
AD6654
ORDERING GUIDE
Model
AD6654BBC
AD6654BBCZ1
AD6654CBC
AD6654CBCZ1
AD6654/PCB
1 Z = Pb-free part.
Temperature Range
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
Active
Channels
6
6
4
4
6
Package Description
256-Lead CSPBGA (Ball Grid Array)
256-Lead CSPBGA (Ball Grid Array)
256-Lead CSPBGA (Ball Grid Array)
256-Lead CSPBGA (Ball Grid Array)
Evaluation Board with AD6654 and Software
Package Option
BC-256-2
BC-256-2
BC-256-2
BC-256-2
Rev. 0 | Page 87 of 88