AD8591SD 查看數據表（PDF） - Analog Devices

零件编号

产品描述 (功能)

生产厂家

AD8591SD

Operational Amplifiers Selection Guide

Analog Devices 

Package Type

Lead frame

chip scale

package

(LFCSP)

Package Dimensions

8-lead: 2 mm 3 2 mm 3 0.55 mm; 0.5 mm pitch

8-lead: 3 mm 3 3 mm 3 0.75 mm; 0.5 mm pitch

8-lead: 3 mm 3 3 mm 3 0.85 mm; 0.5 mm pitch

10-lead: 1.3 mm 3 1.6 mm 3 0.55 mm; 0.4 mm pitch

10-lead: 2 mm 3 2 mm 3 0.55 mm; 0.5 mm pitch

16-lead: 3 mm 3 3 mm 3 0.75 mm; 0.5 mm pitch

16-lead: 4 mm 3 4 mm 3 0.75 mm; 0.65 mm pitch

Package Characteristics

• Surface-mount package

• Leadless package

• Solder plate Pb-free finish

• Molded package

• Exposed pad for thermal

performance

• Package suffix – “CP”

Package Footprint

Wafer level chip 6-ball: 0.905 mm 3 1.385 mm 3 0.6 mm; 0.4 mm pitch

scale package

(WLCSP)

8-ball: 1.42 mm 3 1.42 mm 3 0.595 mm; 0.5 mm pitch

9-ball: 1.21 mm 3 1.22 mm 3 0.6 mm; 0.4 mm pitch

• Surface-mount package

• Ball array

• Solder ball Pb-free finish

• Package suffix – “CB”

14-ball: 1.46 mm 3 2.96 mm 3 0.595 mm; 0.5 mm pitch

70 | Operational Amplifier Selection Guide

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