ADG4612 查看數據表（PDF） - Analog Devices
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ADG4612 Datasheet PDF : 24 Pages
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ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog Inputs; VS to VD
Analog Inputs; VD , VS
Most Negative (VS,VD or VSS) to
Most Positive (VS,VD, Inx, or VDD)
Digital Inputs, INx
Peak Current, Sx or Dx
Continuous Current, Sx or Dx1
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak
Temperature, Pb-free
Rating
18 V
−0.3 V to +18 V
+0.3 V to −7 V
18 V
−7 V to +18 V
18 V
GND − 0.3 V to +18 V
350 mA (pulsed at 1 ms,
10% duty cycle max)
Data + 15%
−40°C to +105°C
−65°C to +150°C
150°C
260 (0/−5)°C
1 See Table 4.
ADG4612/ADG4613
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
THERMAL RESISTANCE
θJA is specified for a 4-layer board and, where applicable, with
the exposed pad soldered to the board.
Table 7. Thermal Resistance
Package Type
16-Lead TSSOP
16-Lead LFCSP
θJA
Unit
112
°C/W
48.7
°C/W
ESD CAUTION
Rev. 0 | Page 9 of 24
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