Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 7.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog Inputs1
Digital Inputs1
Peak Current, Sx, D, or Dx Pins
ADG5208
ADG5209
Continuous Current, Sx, D, or
Dx Pins2
Temperature Range
Operating
Storage
Junction Temperature
Thermal Impedance, θJA
16-Lead TSSOP (4-Layer
Board)
16-Lead LFCSP (4-Layer
Board)
Reflow Soldering Peak
Temperature, Pb Free
HBM ESD
I/O Port to Supplies
I/O Port to I/O Port
All Other Pins
Rating
48 V
−0.3 V to +48 V
+0.3 V to −48 V
VSS − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
VSS − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
126 mA (pulsed at 1 ms, 10%
duty cycle maximum)
92 mA (pulsed at 1 ms, 10%
duty cycle maximum)
Data + 15%
−40°C to +125°C
−65°C to +150°C
150°C
112.6°C/W
30.4°C/W
260(+0/−5)°C
4 kV
1 kV
4 kV
1 Overvoltages at the Ax, EN, Sx, D, and Dx pins are clamped by internal
diodes. Limit current to the maximum ratings given.
2 See Table 5 and Table 6.
ADG5208/ADG5209
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any
one time.
ESD CAUTION
Rev. A | Page 9 of 24