ADG658 查看數據表（PDF） - Analog Devices

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ADG658

+3 V/+5 V/±5 V CMOS 4- and 8-Channel Analog Multiplexers

Analog Devices 

ADG658/ADG659

0.193

BSC

16

9

0.154

BSC

0.236

1

8

BSC

0.065

0.049

PIN 1

0.069

0.053

0.010

0.004

COPLANARITY

0.004

0.025

BSC

0.012

0.008

SEATING

PLANE

8°

0°

0.010

0.006

COMPLIANT TO JEDEC STANDARDS MO-137AB

Figure 34. 16-Lead Shrink Small Outline Package [QSOP]

(RQ-16)

Dimensions shown in millimeters

0.050

0.016

ORDERING GUIDE

Model

ADG658YRU

ADG658YRU-REEL7

ADG658YRUZ1

ADG658YRUZ-REEL71

ADG658YCP

ADG658YCP-REEL7

ADG658YCPZ1

ADG658YRQ

ADG658YRQ-REEL

ADG658YRQZ1

ADG658YRQZ-REEL71

ADG659YRU

ADG659YRU-REEL7

ADG659YRUZ1

ADG659YRUZ-REEL71

ADG659WYRUZ-REEL71, 2

ADG659YCP

ADG659YCPZ1

ADG659YCPZ-REEL71

ADG659YRQ

ADG659YRQ-REEL

ADG659YRQ-REEL7

ADG659YRQZ1

Temperature Range

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

1 Z = RoHS Compliant Part.

2 Qualified for automotive.

Package Description

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Lead Frame Chip Scale Package [LFCSP]

16-Lead Lead Frame Chip Scale Package [LFCSP]

16-Lead Lead Frame Chip Scale Package [LFCSP]

16-Lead Shrink Small Outline Package [QSOP]

16-Lead Shrink Small Outline Package [QSOP]

16-Lead Shrink Small Outline Package [QSOP]

16-Lead Shrink Small Outline Package [QSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Lead Frame Chip Scale Package [LFCSP]

16-Lead Lead Frame Chip Scale Package [LFCSP]

16-Lead Lead Frame Chip Scale Package [LFCSP]

16-Lead Shrink Small Outline Package [QSOP]

16-Lead Shrink Small Outline Package [QSOP]

16-Lead Shrink Small Outline Package [QSOP]

16-Lead Shrink Small Outline Package [QSOP]

Package Option

RU-16

RU-16

RU-16

RU-16

CP-16

CP-16

CP-16

RQ-16

RQ-16

RQ-16

RQ-16

RU-16

RU-16

RU-16

RU-16

RU-16

CP-16

CP-16

CP-16

RQ-16

RQ-16

RQ-16

RQ-16

©2004–2009 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D03273-0-2/09(B)

Rev. B | Page 20 of 20

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