Data Sheet
OUTLINE DIMENSIONS
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
0.50
BSC
5
1.84
1.74
1.64
8
DETAIL A
(JEDEC 95)
TOP VIEW
SIDE VIEW
0.30
0.25
0.20
0.50
0.40
0.30
EXPOSED
PAD
1.55
1.45
1.35
4
1
BOTTOM VIEW
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4
Figure 20. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
CP-8-13
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADL5531ACPZ-R7
ADL5531-EVALZ
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +85°C
Package Description
8-Lead LFCSP, 7” Tape and Reel
Evaluation Board
Package Option
CP-8-13
ADL5531
Branding
Q16
Rev. C | Page 11 of 12