ADP120(RevB) 查看數據表（PDF） - Analog Devices
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ADP120 Datasheet PDF : 20 Pages
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In cases where the board temperature is known, use the thermal
characterization parameter, ΨJB, to estimate the junction tem-
perature rise. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
TJ = TB + (PD × ΨJB)
(5)
140
MAX JUNCTION TEMPERATURE
120
ILOAD = 100mA ILOAD = 75mA ILOAD = 50mA
100
80
ILOAD = 1mA ILOAD = 10mA ILOAD = 25mA
60
40
20
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VIN – VOUT (V)
Figure 46. TSOT, TB = 85°C
140
MAX JUNCTION TEMPERATURE
120
ILOAD = 100mA ILOAD = 75mA
ILOAD = 50mA
100
80
ILOAD = 10mA
60
ILOAD = 25mA
ILOAD = 1mA
40
20
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VIN – VOUT (V)
Figure 47. WLCSP, TB = 85°C
PCB LAYOUT CONSIDERATIONS
Improve heat dissipation from the package by increasing the
amount of copper attached to the pins of the ADP120. However,
as listed in Table 6, a point of diminishing return is eventually
reached, beyond which an increase in the copper size does
not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0402- or 0603-size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
ADP120
GND
ANALOG DEVICES
ADP120-xx-EVALZ
GND
C1
C2
U1
J1
VIN
VOUT
GND
EN
Figure 48. TSOT PCB Layout
GND
Figure 49. WLCSP PCB Layout—Top Side
Figure 50. WLCSP PCB Layout—Bottom Side
Rev. B | Page 17 of 20
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