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AS5013-IQFT 查看數據表(PDF) - austriamicrosystems AG

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AS5013-IQFT Datasheet PDF : 32 Pages
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AS5013
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Operating Conditions on page 5 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Electrical Parameters
VDD
Parameter
DC supply voltage
VDDp
Peripheral supply voltage
Vin
Input pin voltage
Iscr
Input current (latchup immunity)
Electrostatic Discharge
ESD
Electrostatic discharge
ΘJA
Package thermal resistance
Temperature Ranges and Storage Conditions
Tstrg
Storage temperature
Tbody
Package body temperature
Humidity non-condensing
Min
Max
Units
Comments
-0.3
5
V
-0.3
5
VDD +0.3
V
-0.3 VDDp +0.3 V
-
3.6
V
-100
100
mA
Norm: JEDEC 78
-
±2
kV
-
32
K/W
Norm: MIL 883 E method 3015,
direct pad contact
Velocity=0, Multi Layer PCB;
JEDEC Standard Testboard
-55
125
°C
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
260
°C
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
5
85
%
www.ams.com/AS5013
Revision 1.11
4 - 32

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