ATA2525S533C-DDW 查看數據表（PDF） - Atmel Corporation

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ATA2525S533C-DDW

IR Receiver ASSP

Atmel Corporation 

6. Chip Dimensions

Figure 6-1. Chip Size in µm

GND

393,839

990,960

IN

603,828

scribe

OUT

224,495

47,72

VS

Zapping

0,0

ATA2525

Versioning

Note:

width

Pad coordinates are for lower left corner of the pad in µm from the origin 0,0

Dimensions

Pad metallurgy

Finish

Length inclusive scribe

Width inclusive scribe

Thickness

Pads

Fusing pads

Material

Thickness

Material

Thickness

Note: 1. Value depends on manufacture location.

1.04mm

1.11mm

290µ ±5%

80µ × 80µ

60µ × 60µ

AlCu/AlSiTi(1)

0.8µm

Si3N4/SiO2(1)

0.7/0.3µm

ATA2525 [DATASHEET]

9

4854H–AUTO–03/14

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