BD9006F-TR 查看數據表（PDF） - ROHM Semiconductor

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产品描述 (功能)

生产厂家

BD9006F-TR

Flexible Step-down Switching Regulators with Built-in Power MOSFET

ROHM Semiconductor 

BD9006F, BD9006HFP, BD9007F, BD9007HFP

Technical Note

8. GND wiring pattern

It is recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single

ground at the reference point of the set PCB, so that resistance to the wiring pattern and voltage fluctuations due to a

large current will cause on fluctuations in voltages of the small-signal GND. Prevent fluctuations in the GND wiring pattern

of external parts.

9. Temperature protection (thermal shut down) circuit

This IC has a built-in temperature protection circuit to prevent the thermal destruction of the IC. As described above, be

sure to use this IC within the power dissipation range. Should a condition exceeding the power dissipation range continue,

the chip temperature Tj will rise to activate the temperature protection circuit, thus turning OFF the output power element.

Then, when the tip temperature Tj falls, the circuit will be automatically reset. Furthermore, if the temperature protection

circuit is activated under the condition exceeding the absolute maximum ratings, do not attempt to use the temperature

protection circuit for set design.

10. On the application shown below, if there is a mode in which VIN and each pin potential are inverted, for example, if the

VIN is short-circuited to the Ground with external diode charged, internal circuits may be damaged. To avoid damage, it is

recommended to insert a backflow prevention diode in the series with VIN or a bypass diode between each pin and VIN.

Bypass diode

Backflow prevention diode

Vcc

Pin

Fig.30

●Thermal reduction characteristics

HRP7

10

9

8 ④7.3W

7

6 ③5.5W

5

4

3 ②2.3W

2

1 ①1.4W

0

25

50

75 100 125 150

AMBIENT TEMPERATURE：Ta [℃]

① Single piece of IC

PCB Size: 70×70×1.6mm3 (PCB incorporates thermal via)

Copper foil area on the front side of PCB: 10.5×10.5mm2

② 2-layer PCB (Copper foil area on the reverse side of PCB: 15×15mm2)

③ 2-layer PCB (Copper foil area on the reverse side of PCB: 70×70mm2)

④ 4-layer PCB (Copper foil area on the reverse side of PCB: 70×70mm2)

Fig.31

SOP8

0.8

0.7 ②

0.6 ①

0.5

0.4

0.3

0.2

0.1

0

25

50

75 100 125 150

AMBIENT TEMPERATURE：Ta [℃]

① Single piece of IC

② When mounted on ROHM standard PCB

(Glass epoxy PCB of 70mm×70mm×1.6mm)

Fig.32

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© 2009 ROHM Co., Ltd. All rights reserved.

16/17

2009.05 - Rev.A

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