NXP Semiconductors
10. Package outline
Plastic surface-mounted package; 6 leads
BF1208
Dual N-channel dual gate MOSFET
SOT666
D
A
E
X
S
YS
HE
6
5
4
pin 1 index
1
2
e1
bp
e
3
wM A
A
detail X
c
Lp
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
bp
c
D
E
e
e1
HE
Lp
mm
0.6 0.27 0.18 1.7
0.5 0.17 0.08 1.5
1.3
1.1
1.0
0.5
1.7
1.5
0.3
0.1
w
y
0.1 0.1
OUTLINE
VERSION
IEC
SOT666
Fig 35. Package outline SOT666
BF1208
Product data sheet
REFERENCES
JEDEC
JEITA
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2011
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
© NXP B.V. 2011. All rights reserved.
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