CXA1315M 查看數據表（PDF） - Sony Semiconductor

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CXA1315M

8-bit D/A Converter Supporting with I2C Bus

Sony Semiconductor 

CXA1315P

16PIN DIP (PLASTIC)

+ 0.4

19.2 – 0.1

16

9

1

8

2.54

0° to 15°

CXA1315M/P

0.5 ± 0.1

1.2 ± 0.15

Two kinds of package surface:

1.All mat surface type.

2.All mirror surface type.

SONY CODE

EIAJ CODE

JEDEC CODE

DIP-16P-01

DIP016-P-0300

Similar to MO-001-AE

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

SOLDER PLATING

COPPER ALLOY

1.0 g

16PIN DIP (PLASTIC) 300mil

19.35 ± 0.5

16

9

1

8

2.54 ± 0.254

1.016

0° to 10°

0.457 ± 0.076

SONY CODE

EIAJ CODE

JEDEC CODE

DIP-16P-191

DIP016-P-0300-AU

MS-001-AA

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER

PACKAGE WEIGHT

1.0g

– 11 –

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