H21LOB 查看數據表（PDF） - Fairchild Semiconductor
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H21LOB Datasheet PDF : 8 Pages
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Absolute Maximum Ratings (TA = 25°C Unless otherwise specified)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
TOPR
Operating Temperature
TSTG
Storage Temperature
TSOL-I
Soldering Temperature (Iron)(5)(6)(7)(8)
TSOL-F
Soldering Temperature (Flow)(5)(6)(8)
INPUT (Emitter)
IF
Continuous Forward Current
VR
Reverse Voltage
PD
Power Dissipation(3)
OUTPUT (Sensor)
IO
Output Current
VCC
Supply Voltage
VO
Output Voltage
PD
Power Dissipation(4)
Rating
-40 to +85
-40 to +85
240 for 5 sec
260 for 10 sec
50
6
100
50
4.0 to 16
30
150
Units
°C
°C
°C
°C
mA
V
mW
mA
V
V
mW
Notes:
3. Derate power dissipation linearly 1.67mW/°C above 25°C.
4. Derate power dissipation linearly 2.50mW/°C above 25°C.
5. RMA flux is recommended.
6. Methanol or isopropyl alcohols are recommended as cleaning agents.
7. Soldering iron 1/16" (1.6mm) from housing.
8. As long as leads are not under any stress or spring tension.
©2004 Fairchild Semiconductor Corporation
H21L Series Rev. 1.1.0
2
www.fairchildsemi.com
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