HCTS390D/SAMPLE 查看數據表（PDF） - Intersil
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HCTS390D/SAMPLE Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
86 x 86 mils
2190µm x 2190µm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS390MS
HCTS390MS
(2) MR1
Q0 1 (3)
CP1N1 (4)
Q1 (5)
Q2 (6)
(14) MR 2
(13) Q0 2
(12) CP1N 2
(11) Q1 2
(10) Q2 2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS390 is TA14489A.
Spec Number 518634
670
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