HSDL-3201 查看數據表（PDF） - HP => Agilent Technologies

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HSDL-3201

IrDAW Data 1.2 Low Power Compliant 115.2 kb/s Infrared Transceiver

HP => Agilent Technologies 

11

Moisture Proof Packaging

The HDSL-3201 is shipped in

moisture proof packaging. Once

opened, moisture absorption

begins.

Recommended Storage

Conditions

Storage

10°C to 30°C

Temperature

Relative

Humidity

below 60% RH

Recommended Land Pattern for HSDL-3201#011/001/

021 (Front Options)

MOUNTING

CENTER

CL

1.35

SHIELD

SOLDER PAD

1.25

2.05

0.10

0.775

1.75

Time from Unsealing to

Soldering

After removal from the bag, the

parts should be soldered within

two days if stored at the

recommended storage conditions.

If times longer than two days are

needed, the parts must be stored

in a dry box.

0.60

UNIT: mm

0.475

1.425

2.375

3.325

FIDUCIAL

Baking

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Package

In reels

In bulk

Temp.

60°C

100°C

125°C

150°C

Time

≥ 48 hours

≥ 4 hours

≥ 2 hours

≥ 1 hour

Baking should only be done once.

Recommended Land Pattern for HSDL-3201#008/018

(Top Options)

1.275

2.20

1.45

0.9

MOUNTING CENTER

0.575

1.60

0.60

PITCH 7 x 0.95

3.625

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