HSDL-3203 查看數據表（PDF） - HP => Agilent Technologies
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HSDL-3203
HP => Agilent Technologies
HSDL-3203 Datasheet PDF : 19 Pages
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I/O Pin Configuration Table
Pin Symbol I/O
Description
Note
1
CX
I
Pin bypass capacitor
2
SD
I
Shutdown. Active high
1
3
AGND
I
Analog ground
2
4
GND
I
Ground
2
5
RXD
O
Receiver data output. Active low
3
6
VCC
I
Supply voltage
4
7
TXD
I
8
LED A
I
–
Shield
–
Transmitter data input. Active high 5
LED anode
6
EMI shield
7
Notes:
1. Complete shutdown TXD, RXD, and PIN diode.
2. Connect to system ground.
3. Output is active low pulse response when light pulse is seen.
4. Regulated, 2.7 to 3.6 volt.
5. Logic high turns on the LED. If held high longer than ∼50 µs, the LED is turned off
automatically. TXD must be driven either high or low. DO NOT leave the pin floating.
6. Tied through external resistor, R1, to regulate VCC from 2.7 to 3.6 volt.
7. Connect to system ground via a low inductance trace. For best performance, do not connect
to GND directly at the part.
Recommended Application Circuit Components
Component
Recommended Value
Note
R1
30 Ω, ± 1%, 0.125 Watt
8
R1
5.6 Ω, ± 1%, 0.125 Watt
9
C1
6.8 µF, ± 20%, Tantalum
10
C2
100 nF, ± 20%, X7R Ceramic
Notes:
8. To obtain ILED of 50 mA for VLED of 3 V.
9. To obtain ILED of 250 mA for VLED of 3 V.
10. C1 must be placed within 0.7 cm of the HSDL-3203 to obtain optimum noise immunity.
Marking Information
The unit is marked with the
letters "A" and the datacode
"YWW" on the shield for front
options where Y is the last digit
of the year, and WW is the
workweek.
Transceiver I/O Truth Table
Inputs
Outputs
TXD
Light Input to Receiver
SD
LED
RXD
Note
High
Don't Care
Low
On
Not Valid
Low
High
Low
Off
Low
11, 12
Low
Low
Low
Off
High
Don't Care
Don't Care
High
Off
High
Notes:
11. In-band IrDA signals and data rates ≤ 115.2 kbit/s.
12. RXD logic low is a pulsed response. The condition is maintained for a duration independent of pattern and strength of the incident intensity.
Caution: The BiCMOS inherent to the design of this component increases the component's susceptibility
to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in
handling and assembly of this component to prevent damage and/or degradation, which may be
induced by ESD.
3
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