W981208BH 查看數據表（PDF） - Winbond

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W981208BH

4M x 4 BANKS x 8 BIT SDRAM

Winbond 

W981208BH

ABSOLUTE MAXIMUM RATINGS

PARAMETER

Input, Output Voltage

Power Supply Voltage

Operating Temperature

Storage Temperature

Soldering Temperature (10s)

Power Dissipation

Short Circuit Output Current

SYMBOL

VIN, VOUT

VCC, VCCQ

TOPR

TSTG

TSOLDER

PD

IOUT

RATING

-0.3 − VCC +0.3

-0.3 − 4.6

0 − 70

-55 − 150

260

1

50

UNIT

V

V

°C

°C

°C

W

mA

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability

of the device.

RECOMMENDED DC OPERATING CONDITIONS

(Ta = 0 to 70°C)

PARAMETER

SYMBOL

MIN.

Power Supply Voltage

Power Supply Voltage (for I/O

Buffer)

VCC

3.0

VCCQ

3.0

Input High Voltage

Input Low Voltage

VIH

2.0

VIL

-0.3

Note: VIH(max) = VCC/ VCCQ+1.2V for pulse width < 5 nS

VIL(min) = VSS/ VSSQ-1.2V for pulse width < 5 nS

TYP.

3.3

3.3

MAX.

3.6

3.6

UNIT

V

V

-

VCC +0.3

V

-

0.8

V

CAPACITANCE

(VCC = 3.3V, f = 1 MHz, TA = 25°C)

PARAMETER

Input Capacitance

(A0 to A11, BS0, BS1, CS , RAS , CAS , WE , DQM,

CKE)

Input Capacitance (CLK)

Input/Output capacitance

Note: These parameters are periodically sampled and not 100% tested.

SYMBOL

CI

MIN.

-

MAX.

3.8

UNIT

pf

CCLK

CIO

-

3.5

pf

-

6.5

pf

Publication Release Date: October 2000

-5-

Revision A1

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