ISL9000IRFDZ 查看數據表（PDF） - Intersil

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ISL9000IRFDZ

Dual LDO with Low Noise, Very High PSRR, and Low IQ

Intersil 

ISL9000

Absolute Maximum Ratings

Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.1V

All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN+0.3)V

Recommended Operating Conditions

Ambient Temperature Range (TA) . . . . . . . . . . . . . . .-40°C to +85°C

Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 to 6.5V

Thermal Information

Thermal Resistance (Notes 1, 2)

θJA (°C/W) θJC (°C/W)

3x3 DFN Package . . . . . . . . . . . . . . . .

50

10

Junction Temperature Range . . . . . . . . . . . . . . . . .-40°C to +125°C

Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See

Tech Brief TB379.

2. θJC, “case temperature” location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379.

Electrical Specifications

Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature

range of the device as follows:

TA = -40°C to +85°C; VIN = (VO+0.5V) to 6.5V with a minimum VIN of 2.3V; CIN = 1µF; CO = 1µF;

CBYP = 0.01µF; CPOR = 0.01µF

PARAMETER

SYMBOL

TEST CONDITIONS

MIN TYP MAX UNITS

DC CHARACTERISTICS

Supply Voltage

Ground Current

Shutdown Current

UVLO Threshold

Regulation Voltage Accuracy

Maximum Output Current

Internal Current Limit

Dropout Voltage (Note 4)

Thermal Shutdown Temperature

AC CHARACTERISTICS

VIN

IDD1

IDD2

IDDS

VUV+

VUV-

IMAX

ILIM

VDO1

VDO2

VDO3

TSD+

TSD-

Quiescent condition: IO1 = 0μA; IO2 = 0μA

One LDO active

Both LDO active

@25°C

Initial accuracy at VIN = VO+0.5V, IO = 10mA, TJ = 25°C

VIN = VO+0.5V to 5.5V, IO = 10μA to 300mA, TJ = 25°C

VIN = VO+0.5V to 5.5V, IO = 10μA to 300mA,

TJ = -40°C to 125°C

Continuous

IO = 300mA; VO < 2.5V

IO = 300mA; 2.5V ≤ VO ≤ 2.8V

IO = 300mA; VO > 2.8V

2.3

6.5

V

25

32

μA

42

52

μA

0.1

1.0

μA

1.9 2.1

2.3

V

1.6 1.8

2.0

V

-0.7

+0.7

%

-0.8

+0.8

%

-1.8

+1.8

%

300

mA

350 475 600 mA

300 500 mV

250 400 mV

200 325 mV

145

°C

110

°C

Ripple Rejection (Note 3)

IO = 10mA, VIN = 2.8V(min), VO = 1.8V, CBYP = 0.1µF

@ 1kHz

90

dB

@ 10kHz

70

dB

@ 100kHz

50

dB

Output Noise Voltage (Note 3)

IO = 100µA, VO = 1.5V, TA = 25°C, CBYP = 0.1µF

BW = 10Hz to 100kHz

30

μVrms

DEVICE START-UP CHARACTERISTICS

Device Enable TIme

TEN Time from assertion of the ENx pin to when the output voltage

reaches 95% of the VO(nom)

250 500

μs

3

FN9217.3

August 2, 2006

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