Philips Semiconductors
Silicon temperature sensors
Product specification
KTY81-1 series
PACKAGING
Sensors in SOD70 encapsulation are delivered in bulk packaging and also in reel packaging for automatic placement on
hybrid circuits and printed-circuit boards (see Fig.7).
Note: Types in bulk packaging have a lead-to-lead distance of 2.54 millimetres, whereas the distance for types packaged
on reel is 5.08 millimetres.
handbook, full pagewidth
H1
H0
L
P
A1
A
H2
T
(p)
∆h
∆h
W2
W0 W1
W
F1
F2
D0
F
P2
P0
MBH795
t1
t
Fig.7 Configuration of bandolier.
1998 Mar 26
10