NXP Semiconductors
8. Packing information
H1
H0
L
P
A1
A
H2
KTY81 series
Silicon temperature sensors
T
(p)
∆h
∆h
W2
W0 W1
W
F1
F2
D0
F
P2
P0
Fig 5. Configuration of bandolier: spread leads
t1
t
mbh795
Note: Types in bulk packaging have a lead-to-lead distance of 2.54 mm (see Figure 4).
The lead-to-lead distance of types packaged on reel have a lead-to-lead distance of
5.08 mm, spread leads (see Figure 5).
KTY81_SER_5
Product data sheet
Rev. 05 — 25 April 2008
© NXP B.V. 2008. All rights reserved.
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