L9216G 查看數據表（PDF） - Agere -> LSI Corporation

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L9216G

Short-Loop Ringing SLIC with Ground Start

Agere -> LSI Corporation 

L9216A/G

Short-Loop Ringing SLIC with Ground Start

Preliminary Data Sheet

September 2001

Absolute Maximum Ratings (@ TA = 25 °C)

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-

lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess

of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended

periods can adversely affect device reliability.

Parameter

dc Supply (VCC)

Battery Supply (VBAT1)

Battery Supply (VBAT2)

Logic Input Voltage

Logic Output Voltage

Operating Temperature Range

Storage Temperature Range

Relative Humidity Range

PT or PR Fault Voltage (dc)

PT or PR Fault Voltage (10 x 1000 µs)

Ground Potential Difference (BGND to AGND)

Symbol

Min

Typ

—

–0.5

—

—

—

—

—

—

—

—

–0.5

—

—

–0.5

—

—

–40

—

—

–40

—

—

5

—

VPT, VPR VBAT – 5

—

VPT, VPR VBAT – 15

—

—

—

—

Max

7.0

–80

VBAT1

VCC + 0.5

VCC + 0.5

125

150

95

3

15

±1

Unit

V

V

V

V

V

°C

°C

%

V

V

V

Note: The IC can be damaged unless all ground connections are applied before, and removed after, all other connections. Furthermore, when

powering the device, the user must guarantee that no external potential creates a voltage on any pin of the device that exceeds the

device ratings. For example, inductance in a supply lead could resonate with the supply filter capacitor to cause a destructive overvoltage.

Table 4. Recommended Operating Characteristics

Parameter

Min

Typ

5 V dc Supplies (VCC)

—

5.0

3 V dc Supplies (VCC)

3.13

3.3

High Office Battery Supply (VBAT1)

–60

–70

Auxiliary Office Battery Supply (VBAT2)

–12

—

Operating Temperature Range

–40

25

Max

5.25

—

–75

VBAT1

85

Unit

V

V

V

V

°C

Table 5. Thermal Characteristics

Parameter

Min

Thermal Protection Shutdown (Tjc)1

150

28-pin PLCC Thermal Resistance Junction to Ambient (θJA)2:

Natural Convection 2S2P Board

—

Natural Convection 2S0P Board

—

Wind Tunnel 100 Linear Feet per Minute (LFPM) 2S2P Board

—

Wind Tunnel 100 Linear Feet per Minute (LFPM) 2S0P Board

—

48-pin MLCC Thermal Resistance Junction to Ambient (θJA)1, 2

—

1. This parameter is not tested in production. It is guaranteed by design and device characterization.

2. Airflow, PCB board layers, and other factors can greatly affect this parameter.

Typ

165

35.5

50.5

31.5

42.5

38

Max

—

—

—

—

—

—

Unit

°C

°C/W

°C/W

°C/W

°C/W

°C/W

12

Agere Systems Inc.

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