LOC117 查看數據表（PDF） - IXYS CORPORATION
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LOC117 Datasheet PDF : 5 Pages
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LOC117
Manufacturing Information
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Recommended soldering processes are limited to
260ºC component body temperature for 10 seconds.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
2002/95/EC
e3
MECHANICAL DIMENSIONS
8-Pin DIP Through Hole (Standard)
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
7.239 TYP.
(0.285)
3.302
(0.130)
9.144 TYP.
(0.360)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
9.144 ± 0.508
(0.360 ± 0.020)
8.077 ± 0.127
(0.318 ± 0.005)
PC Board Pattern
(Top View)
2.540 ± 0.127
8-0.800 DIA. (0.100 ± 0.005)
(8-0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
8-Pin Surface Mount (“S” Suffix)
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.540 ± 0.127
(0.100 ± 0.005)
4.445 ± 0.127
(0.175 ± 0.005)
3.302
(0.130)
0.635 TYP.
(0.025)
6.350 ± 0.127
(0.250 ± 0.005)
0.254 TYP.
(0.010)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
8.077 ± 0.127
(0.318 ± 0.005)
PC Board Pattern
(Top View)
2.540 ± 0.127
(0.100 ± 0.005)
1.905 ± 0.127
(0.075 ± 0.005)
1.498 ± 0.127
(0.059 ± 0.005)
8.305 ± 0.127
(0.327 ± 0.005)
8-Pin Flatpack (“P” Suffix)
2.159 TYP.
(0.085)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090) 0.635 ± 0.127
(0.025)
0.203
(0.008)
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.398 ± 0.127
(0.370 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
8.077 ± 0.127
(0.318 ± 0.005)
4
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PC Board Pattern
(Top View)
2.540 ± 0.127
(0.100 ± 0.005)
1.193
(0.047)
0.787
(0.031)
8.763 ± 0.127
(0.345 ± 0.005)
Dimensions:
mm
(inches)
R01
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