LT3956 查看數據表（PDF） - Linear Technology
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LT3956 Datasheet PDF : 20 Pages
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Package Description
UHE Package
Variation: UHE28MA
36-Lead Plastic QFN (5mm s 6mm)
(Reference LTC DWG # 05-08-1836 Rev C)
28 27
25 24 23
21 20
0.70 p0.05
30
31
5.50 p 0.05
4.10 p 0.05
32
33
34
1.50 REF
35
36
1.88
p 0.05
3.00 p 0.05
0.12
p 0.05
1.53
p 0.05
3.00 p 0.05
0.48 p 0.05
17
16
15
14
PACKAGE OUTLINE
13
12
LT3956
12
0.50 BSC
34
6
8 9 10
0.25 p0.05
2.00 REF
5.10 p 0.05
6.50 p 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 p 0.10
PIN 1
TOP MARK
(NOTE 6)
6.00 p 0.10
0.75 p 0.05
0.200 REF
0.00 – 0.05
R = 0.10
TYP
28
27
2.00 REF
25
24
23
21
20
1.50 REF
30 31 32 33 34 35 36
1.88 p 0.10
3.00 p 0.10
0.12
p 0.10
PIN 1 NOTCH
R = 0.30 OR
0.35 s 45o
CHAMFER
1
2
3
4
1.53 p 0.10
0.48 p 0.10
3.00 p 0.10
17 16 15
0.25 p 0.05
0.50 BSC
14 13 12
BOTTOM VIEW—EXPOSED PAD
6
8 R = 0.125
TYP
9
10
0.40 p 0.10
(UHE28MA) QFN 0110 REV C
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3956f
19
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